The company is committed to becoming a leading one-stop solution provider for semiconductor wafer-level testing and packaging, fully realizing domestic substitution and assisting the revitalization of China's independent chip industry.
The company has a Shenzhen headquarters, a subsidiary in Malaysia, a production base in Huizhou, and multiple sales centers and channels in East China, South China, Southwest China, Taiwan, and other regions. The research and sales center of the Shenzhen headquarters covers an area of 2000 square meters, mainly used for the research, testing, and verification of semiconductor equipment. The Huizhou production base covers an area of 6000 square meters and can assemble and debug 300 devices at the same time. The company's research and development personnel account for 70%, and each major region has a sales manager.
The semiconductor sorting, testing, and packaging equipment developed and produced by the company is deeply rooted in advanced packaging such as wafer-level chip-scale packaging (WLCSP), system-in-package (SIP), 2.5/3.0D integrated packaging, panel-level packaging (Panel Level Package), MEMS and sensor packaging, WBBGA/WBLGA, FCBGA/FCLGA/FCCSP, Fan-out/Fan-in, third-generation compound semiconductors, and can provide one-stop high-end packaging solutions.
The core team members of our company are dedicated to the high-end equipment manufacturing field of the semiconductor industry. At the beginning of the company's establishment, we paid full attention to and realized the necessity and trend of the country's investment and the conquering of related supporting technologies in the high-end manufacturing field. Combining the experience of the founding team, we chose the direction of semiconductor advanced packaging chip sorting, testing, and packaging equipment. With the rapid development of market demand and the positive promotion of industry capital, Shenzhen Huaxin Intelligent Equipment Co., Ltd. will usher in rapid growth and development.
Our company is a provider of sorting, testing, and packaging solutions for advanced semiconductor packaging, relying on the company's strong visual system processing capabilities and operation and control system capabilities to comprehensively and deeply solve the equipment needs of current domestic and foreign customers in sorting, testing, and packaging processes to achieve cost reduction and efficiency improvement. Meanwhile, we control the research and development, procurement, production and other links to ensure equipment quality and cost control, helping the semiconductor industry upgrade and develop, realizing the independent domestic production of core equipment for China's independent chip industry, and truly helping the development and revitalization of China's semiconductor industry. Shenzhen Huaxin Intelligent Equipment Co., Ltd. closely follows the development trend of the semiconductor era, comprehensively empowering the "core" idea, and lays out the future of the "core" in advance!